Stencil nano-coatings

Lapisan nanoscale (contohnya, Teflon, silikon karbida) meningkatkan pelepasan tampal solder dengan mengurangkan tenaga permukaan ke 15-20 mn/m. Coatings menghalang tampal menyumbat masuk<0.3mm pitch components, improving transfer efficiency by 30%. Durability exceeds 100,000 prints without degradation. Application methods include plasma-enhanced CVD and electrospray. Benefits: Reduced bridging in QFN packages, elimination of manual wiping downtime. Testing confirms >95% kadar pengisian aperture untuk komponen 01005. Batasan termasuk keperluan keseragaman salutan di bawah ketebalan 50nm.