SMT untuk implan

Perhimpunan Implan Perubatan memerlukan pensijilan ISO 13485 . Solders Biocompatible (AUSN, POINT POINT 280 darjah) . Hermetic Sealing: Kimpalan laser dengan<10⁻⁸ atm-cc/sec leak rate. Miniaturization: 0201 components on ceramic substrates. Cleaning: Supercritical CO₂ residue removal. Testing: 10-year accelerated aging per ISO 5840.