Ikatan pelekat SMT
May 27, 2025
Electrically conductive adhesives (Ag-epoxy) replace solder in flexible circuits. Dispensing accuracy: 0.1mm dot size. Cure parameters: UV (5s) or thermal (150°C/30min). Applications: MEMS, display bonding. Shear strength >25mpa per astm d 1002. Cabaran: Kestabilan kekonduksian jangka panjang di bawah kelembapan .
Sepasang: Kawalan SMT Warpage
Seterusnya: Substrat SMT PCB
